Signal Integrity / Power Integrity (SI/PI) Engineer

Build the Next Generation of High-Speed Semiconductor Technology

Are you passionate about solving complex electrical challenges and pushing the boundaries of high-speed semiconductor design? We're looking for a talented Signal Integrity / Power Integrity (SI/PI) Engineer to join our growing engineering team. In this role, you'll work at the intersection of silicon, package, and system design - ensuring signal quality, power delivery, and electrical performance across advanced semiconductor packages and high-speed platforms.

What You'll Do :

- Lead SI/PI analysis and optimization for advanced IC packages, substrates, PCBs, and high-speed interfaces.

- Perform channel analysis, impedance optimization, crosstalk analysis, signal loss evaluation, and timing assessments.

- Drive power integrity analysis, including power distribution network (PDN) modeling, decoupling strategies, IR-drop analysis, and transient response evaluation.

- Define stack-ups, routing constraints, and electrical design guidelines to ensure robust performance.

- Collaborate with silicon, package layout, system architecture, and mechanical engineering teams to translate simulation insights into practical design solutions.

- Review package and PCB designs for electrical performance, manufacturability, and system-level requirements.

- Correlate simulation results with lab measurements and continuously improve analysis methodologies.

- Contribute to simulation automation, tool-flow optimization, and scalable engineering practices.

What We're Looking For :

- Bachelor's degree in Electrical Engineering or equivalent practical engineering experience.

- 5 - 7 years of hands-on experience in SI/PI engineering across IC packaging, PCB, or system-level design.

- Strong understanding of high-speed signal integrity, including impedance control, differential signaling, via modeling, reflections, insertion/return loss, and crosstalk mitigation.

- Solid knowledge of power integrity, including PDN design, decoupling optimization, IR-drop analysis, and transient response modeling.

- Familiarity with high-speed interface protocols and their electrical requirements.

- Experience translating simulation results into actionable design constraints in collaboration with layout and system teams.

- Understanding of PCB or package substrate manufacturing processes and their electrical implications.

- Strong analytical, problem-solving, and communication skills.

Good to Have :

- Hands-on experience with Ansys SIwave, Ansys HFSS, Cadence Sigrity, PowerSI, Cadence Clarity, or Keysight ADS.

- Scripting experience in Python, Perl, or Shell for simulation automation.

- Familiarity with Cadence SKILL or layout automation.

- Experience developing SI/PI design rules, simulation methodologies, and reusable workflows.

- Lab validation experience using high-speed measurement equipment such as TDR and VNA.

Why Consider This Opportunity ?

- Work on challenging, high-speed semiconductor and advanced packaging problems.

- Influence electrical design decisions from simulation through validation.

- Collaborate across silicon, package, and system engineering disciplines.

- Help build scalable SI/PI methodologies and contribute to a growing engineering team.