Role & responsibilities:

1. Technical Leadership:

i. Act as the IC Design & Technical Leader for a team focused on the design of complex front- end modules

ii. Experience managing large technical teams

iii. A track record of growing successful design teams

iv. Ability to set & articulate clear goals and drive accountability to those

v. Use of AI tools to improve productivity, efficiency, automation, bug-tracking and reporting

2. Communication:

i. Drive company communications, strategy, and goals via team meetings and regular 1:1 and reporting to chip leads and managers in the US.

Preferred candidate profile:

- The candidate must have excellent written and spoken communications, sufficient to present program technical status & schedule progress to senior management.

2. EDA & Software tools:

i. Strong experience with the Cadence suite of EDA tools

ii. Knowledge of commonly used IC layout tools

iii. Knowledge of 2D/3D EM simulation tools

iv. Experience with PVT and statistical simulations

3. Circuit Design:

i. Broad and deep expertise in core Analog Design including low bit count data converters (ADC & DAC blocks), Bandgaps, Op-Amps, Bias blocks, Charge-pumps, Temp sensor, Clock and timing, LDO, ESD, e-fuse and other supporting cells.

ii. Good understanding of RF SOI technology including RF switch, tuning & RF LNA design.

iii. Basic Digital Design including SPI & MIPI interface design, Decoding logic, and simple state machines.

iv. Semiconductor process knowledge including SOI, bulk CMOS, SiGe.

v. Must understand the basic device physics, ability to develop and use advanced linear and nonlinear models or simulation techniques and be able to translate between the model, simulation, physical implementation, and the measured performance of a device

- Working knowledge of RF multi-chip modules including 3D Packaging, assembly, thermals and EMI basics.