Mirafra Technologies - Technical Lead - Embedded Networking System

Description :

Experience : 12+ years

Role Overview :

We are seeking a seasoned Technical Lead to drive the design and development of Layer 2 and Layer 3 networking protocols for embedded networking systems.

This role demands deep expertise in packet processing, routing protocols, networking stacks, and close collaboration with silicon/ASIC teams to deliver high-performance networking solutions.

Key Responsibilities :

- Lead the architecture, design, and development of L2/L3 protocols such as :

1. Ethernet, VLAN, STP

2. ARP, IP, TCP/UDP

- Routing protocols including OSPF and BGP

- Own end-to-end protocol stack development in embedded environments

- Collaborate closely with silicon/ASIC and hardware teams for optimized packet processing

- Drive development of high-performance, scalable, and low-latency networking solutions

- Debug and resolve complex system-level and field issues

- Conduct code reviews, enforce coding standards, and ensure high-quality deliverables

- Mentor and guide engineering teams, fostering technical excellence and best practices

Required Skills :

Strong experience in :

- L2/L3 Networking Protocol Development (including OSPF, BGP)

- Embedded Systems

- Networking Silicon (ASIC/SoC/NPU)

Expert-level proficiency in C programming, including :

- Bitwise operations

- Data structures

- Memory management and optimization

Deep understanding of :

- Switching and routing concepts

- Dynamic routing protocols (OSPF, BGP)

- Packet processing pipelines

- Hands-on experience with Linux or RTOS-based networking stacks

Nice to Have :

- Experience with high-speed networking (10G/25G/100G+)

- Exposure to kernel/driver development

- Familiarity with multithreading and multicore architectures