The Head of Engineering will lead the entire semiconductor engineering function, driving chip design strategy, execution, and innovation across RTL, verification, and physical design domains. This role requires a strong combination of technical depth, leadership, and business alignment to scale engineering capabilities and deliver high-quality silicon solutions.

Key Responsibilities :

1. Engineering Leadership :

- Define and execute engineering strategy aligned with business goals

- Build, lead, and scale high-performance VLSI engineering teams

- Establish a culture of innovation, quality, and accountability

2. Technical Oversight :

- Oversee full chip lifecycle : architecture RTL verification physical design tape-out

Ensure best practices in :

- RTL design (Verilog/System Verilog)

- UVM-based verification

- Drive low-power, high-performance, and scalable SoC architectures

3. Program & Delivery Management :

- Own delivery of multiple ASIC/SoC programs with strict timelines

- Ensure quality metrics : PPA (Power, Performance, Area) and first-time-right silicon

- Collaborate with global clients and stakeholders

4. Process & Methodology :

- Define and standardize engineering processes (RTL-to-GDSII flow)

- Drive adoption of advanced EDA tools (Synopsys, Cadence, Siemens)

- Implement design reuse, IP strategy, and automation frameworks

5. Cross-functional Collaboration :

Work closely with :

- Sales & business teams (solutioning)

- Foundries and external partners

- Product and system architects

6. Talent Development :

- Hire, mentor, and retain top semiconductor talent

- Build leadership pipeline across design, verification, and PD teams

Required Qualifications :

- BTech / MTech / PhD in Electronics / VLSI / Electrical Engineering

- 20+ years in semiconductor industry