Posted on: 14/05/2026
Description :
Roles & Responsibilities :
- Perform signal integrity (SI) and power integrity (PI) analysis on advanced package and PCB designs.
- Extract package models and conduct simulations in both time and frequency domains.
- Analyse and optimize interfaces such as DDR, SerDes, and high-speed serial protocols.
- Perform DC drop and decoupling analysis to evaluate PDN performance.
- Provide design feedback and develop guidelines for package and PCB teams.
- Collaborate with internal and client teams to define simulation requirements and deliverables.
- Automate analysis and documentation workflows to improve design efficiency.
- Create technical reports and present findings to engineering teams and clients
Minimum qualifications :
- Bachelors or masters degree in Electronics Engineering.
- 4+ years of experience in Signal and Power Integrity (SI/PI) engineering.
- Solid understanding of electromagnetics, transmission line theory, and crosstalk
- Experience with high-speed signal integrity and power delivery network (PDN) analysis.
- Proficiency in using industry-standard simulation tools (e.g., ADS, PowerDC, PowerSI, Sigrity, Ansys
SIwave, HFSS, HSPICE).
Preferred qualifications :
- Hands-on experience with package extraction and time/frequency domain simulations.
- Familiarity with system-level analysis of DDR, SerDes, and mixed-signal interfaces.
- Knowledge of decoupling and DC drop simulation techniques.
- Experience creating design guidelines for package and PCB layout.
- Ability to develop and automate design workflows using scripting or other automation tools.
- Prior experience collaborating with cross-functional teams (e.g., Layout, Systems, Design).
- Demonstrated ability to present technical findings to internal and external stakeholders.
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Posted in
Semiconductor/VLSI/EDA
Functional Area
Embedded / Kernel Development
Job Code
1635961