Posted on: 05/05/2026
Role : Physical Design Lead
Experience : 812 Years
We are looking for an experienced Physical Design Lead to drive end-to-end chip implementation and signoff activities for advanced technology nodes.
Key Responsibilities :
- Lead end-to-end Physical Design (PD) flow from Netlist to GDSII
- Own floorplanning, placement, CTS, routing, and signoff closure
- Drive timing closure (STA) and physical verification signoff
- Ensure PPA (Power, Performance, Area) optimization at block and chip level
- Collaborate with RTL, DFT, and Verification teams for design convergence
- Debug and resolve timing, congestion, and design rule violations
- Manage multi-block integration and hierarchical design flows
- Ensure clean tape-out delivery within schedule
Technical Skills Required :
- Strong experience in 16nm / 7nm technology nodes
- Hands-on expertise in :
1. Floorplanning
2. Clock Tree Synthesis (CTS)
3. Static Timing Analysis (STA)
4. Physical Verification
- Expertise in industry-standard tools :
1. ICC2
2. Innovus
3. Calibre
4. Formality
5. LEC (Logical Equivalence Checking)
Additional Skills :
- Strong understanding of timing closure methodologies
- Knowledge of power optimization techniques
- Experience in multi-voltage and low-power designs
- Exposure to signoff flows and tape-out process
- Understanding of block-level and full-chip integration
Leadership Requirements :
- Ability to mentor engineers and drive execution
- Strong coordination with cross-functional teams (RTL, DFT, Verification, STA)
- Ownership of project delivery and signoff commitments
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Posted in
Semiconductor/VLSI/EDA
Functional Area
Embedded / Kernel Development
Job Code
1633513