Posted on: 25/11/2025
Key Responsibilities:
- Lead SoC/IP physical implementation through all stages of the RTL-to-GDSII flow for advanced nodes (7nm and below).
- Drive PPA (Power, Performance, Area) optimization at block and top levels.
- Own floorplanning, placement, CTS, routing, and signoff activities to meet design targets.
- Perform STA, IR/EM analysis, and integrate power intent using UPF.
- Ensure full physical verification (DRC/LVS) closure using industry-standard EDA tools.
- Manage ECO implementation, timing closure, and final tapeout preparation.
- Guide and mentor a team of physical design engineers; provide technical leadership throughout the project lifecycle.
- Work closely with RTL, DFT, synthesis, verification, and architecture teams to resolve cross-functional issues.
- Prepare project plans, track execution, and ensure delivery milestones are met.
- Identify and implement flow improvements, automation, and best practices for efficiency.
Required Skills & Experience:
- Strong hands-on experience in RTL-to-GDSII flow at advanced process nodes (7nm, 5nm, 3nm preferred).
- Expertise in floorplanning, placement, CTS, routing, and signoff methodologies.
- Proficiency in:
- STA (Static Timing Analysis)
- IR/EM analysis
- Physical verification (DRC/LVS)
- Power analysis
- Hands-on experience with leading EDA tools such as:
- Cadence Innovus
- Synopsys PrimeTime
- Mentor/Siemens Calibre
- Strong scripting skills in TCL, Perl, Python for flow automation.
- Experience with UPF for power intent implementation.
- Solid understanding of SoC architecture and block/top-level implementation practices.
- Excellent problem-solving, communication, and team leadership skills.
Preferred Qualifications:
- Prior experience leading multiple successful tapeouts.
- Knowledge of advanced packaging, multi-die integration, or chiplet-based design.
- Exposure to cloud-based EDA workflows.
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Posted By
Posted in
Semiconductor/VLSI/EDA
Functional Area
Embedded / Kernel Development
Job Code
1580182
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