Description :

Position : Embedded Build & Packaging Engineer

Experience : 4 - 8+ Years

Location : Bangalore

Job Mode : Work From Office (WFO)

Job Summary :

We are seeking an experienced Embedded Build & Packaging Engineer to join our engineering team in Bangalore. The ideal candidate will have strong hands-on experience in build systems, packaging, and CI/CD automation for embedded firmware, BIOS, and Linux drivers. This role plays a critical part in ensuring reliable, repeatable, and scalable build and release pipelines for embedded and semiconductor programs, working closely with firmware, validation, QA, and SoC teams.

Key Responsibilities :

Design, implement, and maintain build and packaging workflows for :

1. Embedded Firmware

2. BIOS images

3. Linux device drivers and kernel modules

- Develop and maintain Python and Shell scripts to automate build, packaging, and release processes.

- Manage and optimize CI/CD pipelines using Jenkins and Jenkins Pipeline framework.

- Perform build integration for Ubuntu Linux and Yocto Linux based embedded platforms.

- Create and maintain Docker-based build environments for consistency and reproducibility.

- Handle version control, branching, and release management using GitHub.

Work closely with firmware, validation, QA, and SoC teams to :

1. Resolve build failures

2. Improve build reliability

3. Support release milestones

- Support SoC validation activities by delivering timely and stable build artifacts.

- Analyze build and packaging issues, perform root cause analysis, and drive permanent fixes.

- Maintain build documentation, release notes, and packaging guidelines.

- Improve build performance, automation coverage, and overall developer productivity.

Required Skills & Qualifications :

Technical Skills :

- Strong proficiency in Python and Shell scripting.

- Solid experience with Ubuntu Linux and/or Yocto Linux environments.

- Hands-on experience with Jenkins and Jenkins Pipeline framework.

- Practical experience with Docker for build and packaging environments.

- Strong knowledge of GitHub for source control, pull requests, and release management.

- Experience in build and packaging of BIOS and Linux drivers.

- Understanding of embedded build systems and cross-compilation workflows.

- Familiarity with SoC validation procedures and release flows in semiconductor environments.

Additional / Preferred Skills :

- Exposure to UI frameworks for dashboards (Grafana, Flask, Dash, or similar) is an added advantage.

- Knowledge of artifact repositories and release management tools.

- Experience working in semiconductor or product-based companies.

- Awareness of build metrics, KPIs, and CI quality indicators.

Behavioral & Soft Skills :

- Strong problem-solving and debugging skills.

- Excellent communication skills for effective cross-functional collaboration.

- Ability to work with multiple stakeholders across hardware and software teams.

- Self-motivated, detail-oriented, and capable of handling complex build environments.

- Strong documentation and process-oriented mindset.

Educational Qualifications :

Bachelors or Masters degree in :

- Electronics & Communication

- Computer Science

- Electrical Engineering

- Embedded Systems or related fields